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The products and high quality services offered by Surcotec are based on highly innovative and high technology equipment driven by competent engineers. Some practical applications are described in more detail on the left.

These technologies can be divided into two distinct categories:

  • Those using vacuum chambers (10-3 to 10-7 mbar) for PVD and CVD thin film deposition and scanning electron microscope (SEM)
  • Those that use innovative chemical formulations for our dedicated technical products

PVD technologies (Physical Vapor Deposition) enable the deposition of all kind of pure metals or any alloys on all types of substrate. Surcotec uses the PVD deposition type, called Magnetron Sputtering. The latter consists in applying a potential difference between the target and the walls of the deposition chamber under a vacuum allowing a plasma creation. Applying an electric field, positive plasma particles are attracted to and collide with the target (material to be sputtered). They then transfer their energy to the target, causing the sputtering of neutral particles which then condense on the substrate. The film formation is driven by several mechanisms depending on the interaction forces between the substrate and the film. In order to create ceramic like films (oxides, nitrides ...), reactive gases such as oxygen or nitrogen are added to the inert carrier gas.

CVD technology (Chemical Vapor Deposition), enables the vacuum deposition of thin films from gaseous precursors. Surcotec uses one of the PVD deposition type, called MO-PECVD when organometallics precursors are used for the deposition of metals or ceramics with help of a activating plasma. A summary of the CVD technique could be “the exposition of a solid substrate, in a gas-phase, with one or more precursors. These precursors react and/or decompose on the surface of the substrate generating the desired film. This technique is used to produce solid materials of high performance and purity. It is for example commonly used in the semiconductor industry to deposit monocrystalline, polycrystalline or amorphous compounds. These materials include, for example, silicon, silicon oxide, silicon carbides and aluminum oxide.